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Non-destructive 3D Metrology
for Transparent SubstrateDesigned for standalone use in R&D and quality-control environments,
the HT-T1 Desktop is a transmissive holotomography system
for non-destructive 3D RI imaging of transparent materials. -
The Advanced Solution for
Transparent Structure AnalysisCapture sub-micrometer 3D structural details in transparent
materials-no cutting, just refractive-index tomography -
Nondestructive 3D Imaging
of Laser ModificationMaximize TGV yield through non-invaisve, high-resolution (161 nm)
and high-sensitivity(10⁻⁴ Δn) imaging of laser modification.
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Non-invasive 3D Etch Process
Control with HolotomographyCapture 3D images of etched vias and quantify their roughness and
completeness at sub-micrometer resolution
Holotomography
Tomocube's cutting-edge Holotomography technology represents the next generation of 3D microscopic imaging, widely adopted across various industrial sectors. This advanced imaging method enables non-destructive, high-resolution analysis not only of surface features but also of internal structures within samples. Holotomography provides precise volumetric data that captures complex internal details without the need for sample preparation or destruction. Such capabilities are especially valuable in analyzing transparent and semi-transparent materials, including glass substrates, hybrid bonding interfaces, and micro displays. As a result, Holotomography serves as a powerful solution for 3D critical-dimension measurement, detailed structural analysis, and comprehensive defect inspection across industrial applications.
Holotomography is a "CT scan with light" — it reconstructs the inside of transparent materials from laser light, without cutting or coating the sample.
Why Holotomography?
Most fabs already own SEM, X-ray CT, or interferometry tools. Holotomography does not replace them — it fills the gap none of them covers: non-destructive, sub-micron 3D imaging of the inside of transparent materials.
- Non-destructiveFull 3D volume of the sample’s interior — the same panel continues down the line
- No prepNo sectioning, polishing, or coating — measured as-is, intact afterwards
- 130–161 nmSub-micron lateral resolution, minutes per field of view
- 10⁻⁴ ΔnQuantitative refractive-index mapping no other tool class provides
Products
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Tomocube HT-T1™
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- TypeTransmission
- ForTransparent samples
- Lateral resolution161 nm
- RI sensitivity10⁻⁴ Δn
The Tomocube HT-T1™ is a transmission-based holotomography system developed for advanced industrial metrology of transparent materials.
With approximately 10⁻⁴ refractive-index sensitivity, it enables precise 3D visualization of subtle internal variations, laser modification, TGV structures, inner-wall roughness, photonic waveguides, and other embedded features.
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Tomocube HT-R1™
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- TypeReflection
- ForOpaque substrates
- Lateral resolution130 nm
- Surface sensitivity0.1 nm
The Tomocube HT-R1™ is the world’s first reflection-based holotomography system developed for advanced industrial metrology of opaque substrates.
With approximately 0.1 nm surface sensitivity, it enables precise 3D imaging of fine RDL structures, hybrid bonding interfaces, micro displays, CMP surface roughness, and other embedded multilayer features.
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Start from your sample, not the spec sheet.
My sample is transparent or semi-transparent — glass substrates, TGV panels, optical films, waveguides, HOEs — and I need to see inside it.
→HT-T1™Transmission
My sample sits on an opaque substrate — silicon wafers, metal layers, PCBs — and I need surface and embedded-layer measurement (RDL, hybrid bonding, CMP).
→HT-R1™Reflection
Full specifications — resolution, sensitivity, configurations, software — are on each product page: HT-T1™ specs · HT-R1™ specs
Applications
Claims are easy; data is convincing. Representative measurement examples show exactly what a holotomography result looks like for each application.
TGV sidewall roughness, quantified in 3D — without cutting the panel
A glass panel with laser-etched vias is imaged as a full 3D volume. Via depth, taper angle, sidewall roughness, and internal microcracks are extracted from a single non-destructive scan — the same panel continues down the line.
Buried waveguide shape and refractive index, mapped in 3D — non-destructively
Photonic circuits hide their critical structures below the surface. Transmission-mode holotomography reconstructs the 3D shape and refractive-index distribution of buried waveguides and laser-written structures, revealing fabrication quality and mode-field accuracy without sectioning the device.
Cu pad recess and bonding-interface roughness, before yield loss happens
Hybrid bonding succeeds or fails on nanometers. Reflection-mode holotomography maps Cu pad recess depth and dielectric surface roughness across the field with 0.1 nm height sensitivity, flagging out-of-spec areas pre-bond.
Pixel-level layer thickness uniformity across a micro display
Thin-film layers and pixel structures in LEDoS/OLEDoS devices are measured non-destructively, layer by layer. Refractive-index and thickness variations reveal coating defects long before electrical or optical test.
See your own sample in 3D
The fastest way to evaluate holotomography is with your sample, not ours.
Send us a sample — we measure it and review the full 3D dataset with you, free of charge.
- 01Send your sample
under NDA - 02We measure it and prepare
a full 3D analysis report - 03Review the data live
with our application engineer
Tomocube HT technology
Open up a new horizon
Tomocube was founded in 2015 from KAIST research that pioneered holotomography, and proved the technology in life science labs worldwide. The Precision Division brings that same imaging physics to semiconductor and display manufacturing — where transparent materials like glass substrates are becoming the backbone of advanced packaging, and where conventional metrology must cut samples apart to see inside them.
- 2015Founded as a KAIST spin-off, Daejeon, Korea
- KOSDAQPublicly listed, November 2024
- ISO 9001 / 14001Certified quality & environmental management
- 230+Peer-reviewed publications by our founding team