Glass substrate and TGV
Glass substrates are essential in advanced semiconductor packaging, including glass interposers with fine-pitch, high-aspect-ratio TGVs and glass cores with larger vias in thicker glass layers. Accurate inspection of these structures is critical to ensure product reliability. However, conventional tools often struggle to inspect internal features deeply buried inside the glass — especially tiny cracks or rough surfaces that may lead to failures. Holotomography captures the full 3D structure of vias and surrounding glass non-destructively. It can visualize internal features, sidewalls, subsurface cracks, and even provide cross-sectional images similar to observing a physical cut, without damaging the sample — regardless of via size, depth, or glass thickness (up to 2 mm).
Features
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- Full 3D Via Imaging
- Capture the entire 3D structure of vias, including depth, sidewalls, and bottom.
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- Crack Detection
- Detect internal micro-cracks inside the glass
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- Aspect Ratio Independent
- Accurately measure both narrow, deep vias and wide, shallow vias.
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- Deep Glass Inspection
- Non-destructive 3D imaging up to 2 mm glass thickness.
Discover Glass substrate and TGV with HT
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Laser Modification Analysis
Holotomography provides non-destructive, high-resolution 3D visualization of laser-induced modifications within glass-core substrates by mapping minute refractive index changes. This allows for the precise characterization of modified zones and micro-cracks, which is essential for ensuring high-quality TGV (Through Glass Via) formation through optimized selective etching. By quantifying internal stress and structural alterations, it enables rapid calibration of laser parameters during material transitions or equipment maintenance. Ultimately, this technology streamlines the development process by replacing destructive cross-sectional analysis with comprehensive, real-time spatial data.
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Optimized Etching Process Control
Holotomography provides a high-speed, non-destructive solution for 3D TGV analysis following chemical etching, delivering precise measurements of top/bottom diameters and taper angles. It enables full-volume mapping of the via's internal profile to ensure structural consistency and uniformity across the entire glass-core substrate. By detecting etching residues, uneven sidewall roughness, or hidden micro-defects within high-aspect-ratio vias, it eliminates the need for time-consuming and destructive cross-sectioning. This real-time spatial data allows for immediate calibration of etchant concentrations and process timing to maximize manufacturing yield. Ultimately, verifying the integrity of the via structure post-etching ensures the reliability of subsequent metallization and plating stages.
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Enhanced AOI Inspection Support
Holotomography enhances traditional AOI by providing high-resolution 3D validation for detected defect candidates, significantly reducing false calls and "overkill." It delivers sub-micron spatial data to precisely classify internal voids or micro-cracks that high-speed surface AOI cannot fully characterize. This non-destructive mapping replaces time-consuming cross-sectioning, providing a faster, more cost-effective path to root cause analysis. By delivering deep insights into defect morphology, our technology enables immediate process optimization and maximizes manufacturing yield.
