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The Advanced Solution for
Transparent Structure AnalysisCapture sub‑micrometer 3D structural details in transparent
materials—no cutting, just refractive‑index tomography. -
Nondestructive 3D Imaging
of Laser ModificationMaximize TGV yield through non‑invasive, high‑resolution (161 nm)
and high‑sensitivity (10⁻⁴ Δn) imaging of laser modification. -
Non‑invasive 3D Etch Process
Control with HolotomographyCapture 3D images of etched vias and quantify their roughness and
completeness at sub‑micrometer resolution
Holotomography
Tomocube's cutting-edge Holotomography technology represents the next generation of 3D microscopic imaging, widely adopted across various industrial sectors. This advanced imaging method enables non-destructive, high-resolution analysis not only of surface features but also of internal structures within samples. Holotomography provides precise volumetric data that captures complex internal details without the need for sample preparation or destruction. Such capabilities are especially valuable in analyzing transparent and semi-transparent materials, including glass substrates, hybrid bonding interfaces, and micro displays. As a result, Holotomography serves as a powerful solution for 3D critical-dimension measurement, detailed structural analysis, and comprehensive defect inspection across industrial applications.
Products
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Tomocube HT-T1™
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The Tomocube HT-T1™ is a transmission-based holotomography system specifically developed as an advanced industrial metrology tool, leveraging Tomocube’s second-generation holotomography technology. Its key strength lies in accurately imaging subtle refractive index variations within transparent materials, achieving a refractive index sensitivity of approximately 10⁻⁴, enabling precise three-dimensional mapping of refractive index distributions. This unique capability facilitates detailed imaging and measurement of critical structural features, including phase changes in glass induced by laser modification during the Through Glass Via (TGV) formation process, the comprehensive 3D structure of TGVs, and the roughness of TGV inner walls. Additionally, the HT-T1™ excels in visualizing intricate 3D structures in silicon photonics waveguides and Holographic Optical Elements (HOE), providing insights and detailed analysis that surpass the capabilities of conventional optical metrology systems. Thus, the HT-T1™ serves as an essential solution for advanced industrial inspection, structural analysis, and quality assurance.
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Tomocube HT-R1™
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The Tomocube HT-R1™ is the world’s first and only reflection-based holotomography system, redefining capabilities in 3D optical metrology. Designed to extend imaging capabilities to industrial samples with opaque substrates such as silicon wafers, metal layers, and PCBs, the HT-R1™ addresses limitations inherent to traditional transmission-based systems. As semiconductor devices become increasingly integrated, the shrinking linewidths in Redistribution Layers (RDL), complexities in hybrid bonding interfaces, micro displays, and stringent roughness requirements in Chemical Mechanical Planarization (CMP) processes pose significant measurement challenges. The HT-R1™ effectively overcomes these challenges, enabling precise, high-resolution imaging and measurement of fine RDL structures, hybrid bonding interfaces, and surface roughness in CMP processes. With its advanced optical design, the HT-R1™ delivers exceptional sensitivity in capturing structural details, phase variations, and multilayer compositions with transparent materials such as SiO₂, providing critical insights for advanced industrial inspection and quality assurance.
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In Through Glass Via (TGV) manufacturing, the Holotomography system allows precise analysis of structures formed under different laser modification conditions, including imaging glass phase changes resulting from laser modification processes. It also accurately captures the shape of vias after the etching process, detects internal microcracks, and measures the roughness of via sidewalls, providing valuable insights for process optimization and quality control.
In PICs (Photonic Integrated Circuits) and waveguide applications, the Holotomography system enables high-resolution, non-destructive inspection of internal optical structures within transparent substrates. It visualizes the 3D shape and refractive index distribution of buried waveguides, allowing detailed evaluation of fabrication quality and optical performance. The system also supports precise analysis of laser-written structures, including mode field profiles and alignment accuracy, offering critical data for optimizing design parameters and ensuring consistent device performance.
In advanced packaging applications, the Holotomography system delivers high-resolution, non-destructive 3D inspection capabilities essential for next-generation integration technologies. It enables precise measurement of Cu pad recess depth to ensure bonding surface uniformity, and accurately quantifies surface roughness at bonding interfaces—key factors for achieving high-yield hybrid bonding. Additionally, the system performs 3D critical-dimension (CD) measurements of fine Redistribution Layer (RDL) lines, capturing their width, height, and profile without physical contact. These insights support advanced process control, defect detection, and optimization across wafer-level and chip-level packaging workflows.
The Holotomography system is optimized for the precise analysis of next-generation display technologies, particularly micro displays such as LEDoS and OLEDoS. It enables high-resolution measurement of thin film layers, pixel structures, and optical coatings, ensuring uniformity and structural integrity. Additionally, the system provides quantitative analysis of refractive index variations, layer thickness, and surface roughness, allowing for advanced defect detection and quality control in ultra-compact display manufacturing.